Henkel Introduces Low-Viscosity Polyamide Hot Melt for Electronics Encapsulation

Henkel has introduced Technomelt PA 6370, a polyamide-based hot melt adhesive designed for encapsulation of electronic components with narrow-gap geometries.

According to Henkel, the formulation was developed for small-gap electronic assemblies operating in harsh environments and is capable of filling gaps as small as 0.5 mm. The company stated that the material’s low melt viscosity is intended to support penetration and wetting in intricate component layouts.

Henkel reports that Technomelt PA 6370 has a melt viscosity of 2700–3000 mPa·s at 210°C and 1065–1180 mPa·s at 240°C. The company also stated that the material maintained lap shear performance after 1,200 hours of exposure to 85°C / 85% relative humidity.

In addition, Henkel said the hot melt provides electrical insulation properties, meets the UL 94 V-0 flame retardancy standard, and offers a coefficient of thermal expansion of 175 ppm. The company reported that the formulation is designed for dimensional stability and stress resistance across an operating temperature range of -20°C to 140°C.

Henkel identified potential applications including motors, connectors, sensors, printed circuit boards, and other low-voltage electronic devices exposed to demanding outdoor or industrial service conditions.

Justin Kolbe, Senior Business Development Manager at Henkel, said the material was developed to address the challenge of achieving void-free small-gap filling while maintaining adhesion after exposure to water, humidity, salt fog, and temperature aging.

Source: Henkel