Functional Polymers to Enhance Adhesion on Packaging Substrates OnDemand
On Demand Webinars
Sustainability, changing substrates, and safer materials are amongst the challenges facing and impacting hot melt adhesive producers. The need for sustainable solutions has driven substrates to include higher recycled content and various surface coating for improvement in quality, functionality, and appeal in packaging. Examples include cardboard that can be coated with bi-axially oriented polypropylene, wax, or glossy printing, which are difficult to adhere to due to low porosity and highly polar coatings. This study provides an in-depth analysis of the substrates and explores the role of functional polymers to improve adhesion.
Objectives:
- Overview of Hot melt adhesive technology for packaging case and carton application
- Susbstrate changes and fundamental understanding of interfaces
- Mechanism of adhesion to different substrates and need for functionality
- Role of different functional polymers in enhancing adhesion
SPEAKER
SHANKAR CV RAM
Senior Research Specialist, DOW
Shankar CV Ram is an Associate TS&D Scientist in the Packaging and Specialty Plastics TS&D group at the Dow Chemical Company. Shankar is the North America Application Development Leader for hot melt adhesives and supports application development across infrastructure, consumer, and transportation markets. He received his PhD in Chemical Engineering from The Pennsylvania State University, and master’s from the University of Pennsylvania.