Epoxy Chemistry and Formulations Bundle - On Demand

This four-part series on Epoxy chemistry and formulations offers an in-depth knowledge of epoxy adhesives. Topics such as types of epoxies, their formulations, impacts of additives for toughening, conductive properties and flame retardancy are covers in the first two presentations. The next two presentations focus on the recyclability, cryogenic toughening, advanced curing and sustainability aspects of epoxy adhesives. This presentation bundle is ideal for anyone in product development, technical sales, or regulatory affairs, giving you insights and tools to innovate responsibly and competitively in the evolving adhesives market.

Epoxy Chemistry and Formulations - Part 1

This presentation gives an overview of the major types of epoxy adhesives, along with their properties and general formulation. Examples include one component latent epoxy adhesives, two component amine cured epoxy adhesives, and quick cure mercaptan based epoxy adhesives. Structure property relationships of epoxy resins, reactive diluents and curing agents will be reviewed to give the formulator an understanding of how to improve key areas, such as adhesion, flexibility/elongation, thermal resistance, chemical and water resistance and cure speed.

Epoxy Chemistry and Formulations - Part 2

This presentation will give a thorough overview on how additives can be incorporated into epoxy adhesives to achieve specific properties. Reducing the cure time and temperature for one component heat cured epoxy adhesives is critical and the use of accelerators to achieve this will be discussed. Epoxy adhesives must be tough and durable, and the use of different toughener chemistries will be presented to achieve a tough adhesive with minimal impact on other properties of the adhesive. Bonding to different substrates and oily and poorly prepared
substrates is often a challenge in epoxy adhesives, and different additives designed to improve adhesion will be reviewed.

E-mobility is a growing area for two-component epoxy adhesives, with thermal conductivity being an important property, and additives to improve thermal conductivity and their effect on epoxy adhesives will be discussed. Finally, additives to improve the flame retardancy of epoxy adhesives will be examined.

Advanced Epoxies - Part 3

This presentation will cover more advanced and emerging topics of epoxy resins used in adhesives and sealants.  With sustainability becoming an ever-important property of adhesives and sealants, a novel method of crosslinking for recyclability will be covered along with new biobased epoxy resins and their properties.  Applications for epoxy adhesives sealants are also becoming more challenging and are now being used in cryogenic environments.  New methods of achieving fracture toughness at cryogenic temperatures will be reviewed to formulate adhesives used in these challenging applications.

Innovations in Epoxy Adhesives: Bio-Based Solutions, Advanced Curing, and Future Trends – Part 4

This presentation explores the emerging technologies and sustainability trends shaping the future of epoxy resins in adhesive applications. This presentation will focus on cutting-edge advancements including integration of nanomaterials to enhance performance, and next-generation curing technologies such as UV, microwave, and dual-cure systems that offer faster processing and tailored properties.  The growing impact of regulatory changes and the drive toward sustainable and low-VOC adhesive solutions, helping formulators and manufacturers stay ahead of global environmental and compliance trends is also discussed.