Silicones for Electronic Assembly: Principles & Applications Webinar
Webinar will highlight specific characteristics & properties of electronics
You will receive an email with a link to the GoToWebinar form once your registration is processed
* Registration open until 7/19/23 at 10:00 AM (EST)
Silicones are broadly used in electronics assembly to prolong the life of modules and enhance safety due to their intrinsic physical properties such as dielectric strength, heat stability and flame retardancy. Silicone materials can either protect, bond and/or conduct heat of electronics parts in versatile high value applications such as automotive, aerospace or communication.
This Webinar will highlight the specific characteristics and properties of silicone polymers in electronics. The Webinar contains case studies with good practice recommendation to illustrate some important material properties, such as (1) an efficient moisture protection of modules, (2) management of the coefficient of thermal expansion and (3) surface preparation to improve adhesion performance.
The different forms and chemistries of silicones commercially available to serve electronic applications are reviewed (1) Adhesives, (2) Encapsulants / Gels, (3) Conformal Coatings and (4) Thermally Conductive materials. Their similarities (e.g., the need for developing a strong interfacial contact with the substrate to assure protection) as well as their differences (e.g., shock absorbing ability) is explained.
- Learn the advantages and limitations of Silicones in electronics
- Be able to understand the different type of cure chemistries commercially available
- Learn best practise for a reliable usage of silicone materials
- Gain sufficient knowledge to make a successful material selection
- Be able to identify a suitable silicone material in respect of form, physicals properties and processability for a variety of electronics applications
- Key Silicone properties for electronics applications
- Case Study I: Moisture Protection
- Case Study II: Coefficient of Thermal Expansion
- Case Study III: Surface Preparation to improve Adhesion performance
- Cure Chemistries: (1) Hydrosilylation one part, (2) Hydrosilylation two parts, (3) Condensation one part, (4) Condensation two parts, and (5) Radical
- Comparison of silicone forms (1) Adhesives, (2) Encapsulants / Gels, (3) Conformal Coatings and (4) Thermally Conductive materials
Who Should Attend:
This webinar is highly applicable to professionals in the assembly, transportation, electronics,aerospace and communication industries. Professionals in technical roles, manufacturing and process engineering will gain an in depth knowledge of the subject matter.
Sandrine Teixeira de Carvalho
Stammer Chemie GmbH
Sandrine Teixeira de Carvalho obtained a M.Sc. in Chemical Engineering from the Meurice Engineering High School of Brussels in 1994. She has worked at Dow Corning and Dow during 25 years as Application Engineer for the Automotive market. Ms. Teixeira’s career is focused on identifying and translating the need of the Electronic Automotive Industry for protection and assembly to advanced materials. She has acquired a deep global market knowledge in automotive electronics. She strongly contributed to the development and characterization of a series of novel silicone materials for both assembly and thermal applications, with a specific focus on thermal interface materials. Aside her Global Key Account Technical Leader role to Automotive Tier 1 and OEM, she was the representative of the Application Engineering function at the Transportation Market Leader Team. Her mission was to propose Advanced Assembly Technical Roadmaps aligned to automotive industry needs for Dow. Sandrine Teixeira de Carvalho’s worked on the population of a healthy commercial portfolio for innovative materials enabling robust, reliable, and cost-efficient designs of electronics modules with tailored dispense and stable flow attributes. She is currently working as a freelance consultant in Stammer Chemie to support Professionals with polymer technical solutions for electronic applications.