Moisture Effects on Adhesive Bond Performance
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Event Details
Abstract:
Moisture is a critical limiting factor in adhesion performance across many industrial applications and remains one of the leading causes of adhesion failure, regardless of polymer chemistry. Its presence can lead to corrosion, delamination, electrical breakdown, and fluid or gas leakage.
This webinar explores the fundamental hydrolytic mechanisms by which moisture degrades adhesion strength at both the material and interface levels. Attendees will gain insight into how moisture affects different polymer systems and substrate types. The session will outline two key mitigation strategies: reducing moisture ingress through polymer design and reinforcing interfacial bonding. Practical guidance will be provided to help minimize moisture-induced failure in demanding applications.
Objectives:
- Mechanisms for improving moisture resistance to achieve durable adhesion performance
- Approaches for reducing moisture-induced failure thru informed selection of materials and substrates
- Criteria for selecting polymer systems with inherently low water absorption and low water vapor permeability
- The role of filler surface treatments and interfacial chemistry in enhancing hydrophobicity and moisture barrier properties
- Evaluation of substrate types and surface treatment technologies that minimize hydrolytic degradation at the adhesive-substrate interface.
Agenda:
- Hydrolytic degradation mechanism and their influence on interfacial adhesion strength
- Comparison of moisture ingress effect for polymer-substrates assembly combinations
- Filler treatment overview, performance considerations and recommendations
- Surface treatment methods: overview and application guidelines
- Identification of moisture-related failure risk thru targeted testing
Who Should Attend:
This webinar is ideal for assembly and transportation market segments including E-mobility, electronics, appliances and aerospace. Professionals in technical functions including marketing and TS&D will find the content insightful.
SPEAKER
Sandrine Teixeira
Stammer Chemie GmbH
Sandrine Teixeira de Carvalho obtained a M.Sc. in Chemical Engineering from the Meurice Engineering High School of Brussels in 1994. She has worked at Dow Corning and Dow during 25 years as Application Engineer for the Automotive market. Ms. Teixeira’s career is focused on identifying and translating the need of the Electronic Automotive Industry for protection and assembly to advanced materials. She has acquired a deep global market knowledge in automotive electronics. She strongly contributed to the development and characterization of a series of novel silicone materials for both assembly and thermal applications, with a specific focus on thermal interface materials. Aside her Global Key Account Technical Leader role to Automotive Tier 1 and OEM, she was the representative of the Application Engineering function at the Transportation Market Leader Team. Her mission was to propose Advanced Assembly Technical Roadmaps aligned to automotive industry needs for Dow. Sandrine Teixeira de Carvalho’s worked on the population of a healthy commercial portfolio for innovative materials enabling robust, reliable, and cost-efficient designs of electronics modules with tailored dispense and stable flow attributes. She is currently working as a freelance consultant in Stammer Chemie to support Professionals with polymer technical solutions for electronic applications.