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Nanoindentation and Atomic Force Microscopy (AFM)

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Description

Nanoindentation and atomic force microscopy (AFM) have become common tools in materials characterization laboratories. While nanoindentation is typically used to characterize mechanical properties, notably modulus and hardness, and AFM is often used to measure surface topography, both of these techniques, can also be used to characterize adhesion at the small scale. This webinar will discuss the how these two techniques can be used for adhesion characterization and show example measurements on several material systems. The webinar will also explain common adhesion mechanics models used to analyze data from AFM and nanoindentation measurements. Finally, the webinar will discuss challenges and limitations in using these techniques to characterize adhesion.

 

LEARNING OBJECTIVE:

  1. Learn the basics of nanoindentation and atomic force microscopy
  2. Become familiar with basic contact mechanics needed to analyze AFM/nanoindentation measurements
  3. Learn techniques and challenges associated with using AFM for adhesion characterization
  4. Learn techniques and challenges associated with using nanoindentation for adhesion characterization

EXPERT PRESENTER:

 

Kevin T. Turner, Ph.D., Professor - University of Pennsylvania 

Kevin T. Turner is a Professor and the Associate Chair for Graduate Affairs in the Department of Mechanical Engineering and Applied Mechanics at the University of Pennsylvania. Professor Turner also holds a secondary appointment in Material Science and Engineering. All his degrees are in Mechanical Engineering, a BS from the Johns Hopkins University in 1999 and MS and PhD from MIT in 2001 and 2004, respectively. Prior to joining the University of Pennsylvania in 2011, he was on the faculty in the Department of Mechanical Engineering at the University Wisconsin-Madison. His primary research interests are related to problems at the intersection of mechanics, materials, and manufacturing. His current research covers multiple topics including, structured surfaces with tunable adhesion, experimental methods to characterize interface mechanics across length scales, nanocomposites, and transfer/printing processes for manufacturing flexible and hybrid electronic devices. 

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