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New Therma-Conductive Adhesive For Heat-Generating Components

Posted By ASC, Tuesday, June 25, 2019
Updated: Monday, June 24, 2019

MG Chemicals has launched a new thermally-conductive two-part epoxy adhesive for use bonding heat-generating components in the assembly of electronics, including items like heatsink heat exchangers and LEDs. The adhesive can be applied with dual-syringes, mix-tips, and automatic dispensing systems.


According to MG, the adhesive has a thermal conductivity of 1.1W/(m.K) which works for 45minutes. If left at room temperature it will cure in 24 hours, a time-span that will speed up to 2.5 hours if the temperature is raised to 65C or 149 F. 


MG reports that the MG Chemical 8329TFM adhesive is thixotropic, bonds well to various substrates, and provides strong electrical insulation. The smooth, dark grey adhesive is also claimed to be highly resistant to salt water, humidity, alphatic hydrocarbons and mild bases. It has a shelf life in excess of three years.

 

 

Tags:  Industry News 

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