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Master Bond Inc Introduces New Adhesive for Electronics and Electro-Optics

Posted By ASC, Thursday, October 4, 2018

New Jersey-based Master Bond Inc has launched a new thermally stable two-part epoxy adhesive to be used in bonding electronic and electro-optic components. The adhesive, E70CN, will be used by OEMs and the aerospace industry.  The company says that the formulation is environmentally friendly, exhibits a high degree of physical strength and can be used for coating, bonding, sealing, and potting.

 

According to Master Bond, its clients can expect a tensile strength of 11,000 to 12,00 pounds per square inch and a modulus of between 30,000 and 350,000 pounds per square inch from the product. When optimally cured, the epoxy has a relatively high chemical resistance. For optimal curing, the company recommends an overnight cure at room temperature. After that, three to four hours of exposure to temperatures of 140 to 170 Fahrenheit will complete the curing process.

E70CN is compatible with a wide variety of substrates including ceramics, metals, plastics,and rubbers.

 

Tags:  Industry News 

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