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New Electronics Assembly Adhesive from Dow Corning for OEMs

Posted By ASC, Tuesday, August 1, 2017

With electronic devices becoming important features in today’s newest cars, OEMs have been seeking adhesives that can tolerate harsh environments, provide robust bonds, cure quickly at relatively low temperatures, and bond a variety of substrates reliably. Dow Corning’s new EA-5151 Quick in Connect (QiC) Adhesive seeks to address these issues.

The one-part silicone adhesive is designed for use with plunger driven applicator guns or robotic applicators and delivers instantaneous green strength, allowing components to be handled immediately after the adhesive has been applied. The bonds will cure fully thanks to exposure to ambient humidity within three days at room temperature, but if heated to between 120°C and 130°C before 24 hours have passed, the adhesive can be removed, allowing manufacturers to reassemble components if necessary.

Dow says that its newest adhesive is flexible, offers shock, and impact resistance, and will provide manufacturers with a cost and energy efficient solution that compares favorably with earlier adhesives and double-sided tapes.


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