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YINCAE Advanced Materials Releases New Solder Joint Encapsulant Adhesive Paste for Microelectronics to Replace Solder Paste and Flux

Posted By ASC, Thursday, June 29, 2017

YINCAE, manufacturers of coatings, adhesives, and materials used in microchips and optoelectronics, has announced its release of a new solder joint encapsulant paste, SMT 256EP. The company says that the adhesive replaces traditional underfill, solder paste and flux while resulting in joints that are five to ten times stronger than those it was previously possible to achieve. The stronger joints retain their integrity at temperatures of up to 280°C with a pull strength of 180g at this high temperature.


By eliminating the need for red glue during double reflow, the solder paste will reduce manufacturing costs, and it can be used in both dispensing and printing scenarios. Specifically designed for mass production, the product has excellent thermocycling properties and can be reflowed at 230°C. YINCAE believes that its innovation will be widely adopted within the microelectronics industry thanks to the cost savings it enables.


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