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New Flexible Adhesive Patent Application from Boeing

Posted By ASC, Monday, October 5, 2015
A new patent application for a flexible adhesive has been submitted by aerospace company Boeing. The flexible adhesive is designed for use in electronic circuit boards intended for aerospace applications. The adhesive will form a cured adhesive structure that connects circuit boards to electronic components. The new adhesive will offer better thermal management in order to ensure the effective functioning of electronic components beyond the earth’s atmosphere and is expected to be applicable to unmanned space missions since it allows for greater heat generation by miniaturized semiconductors.

Tags:  Industry News 

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