Bonding Difficult Substrates
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6/17/2015
When: 6/17/2015
10:00 AM


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Webinar Time:

June 17, 2015 – 10:00 AM EST (60 minutes) presentation plus Q&A session
 

Session Description:


Every market has difficult to bond substrates. From high strength steels and new materials in transportation and electronics to plastics in medical and packaging.  Selecting the chemical routes and mechanical processes for bonding substrates will depend significantly on the substrate properties and the assemblies containing them.  The design must anticipate the range of mechanical and thermal stresses expected during the lifetime of the component. This webinar will address facets of cross-bonding between metals and polymeric materials.

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