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ChemQuest Reports on Demand for Emerging Low Bake Single Component Epoxies for OEMs at ASC’s 2016 Fall Convention

Posted By ASC, Friday, November 4, 2016

At ChemQuest’s presentation at the 2016 ASC Fall Convention in Indianapolis, Indiana in October entitled “The Next Generation of Epoxy Adhesives Technology for Transportation Assembly: Low Bake One-Component Epoxies”, Dan Daley, senior consultant, discussed the long-awaited, emerging low bake 1K epoxy technology that is being developed to address an unmet need in OEM assembly operations.

 

ChemQuest reports that new low bake 1K epoxies will meet OEMs’ assembly needs. The adhesives will reduce production costs, and will deliver better performance than full immersion e-coat systems. Auto and truck body designers often specify 1K epoxy adhesives since they provide superior bonding performance and production line efficiency. However, these previously required high temperature curing in an e-coat system.

 

Now, low bake 1K epoxies will eliminate the need for costly high bake systems while still offering the same performance. However, using low-bake adhesives may necessitate some changes in materials choices or production processes, since materials such as bake-hardenable steel will no longer be subjected to sufficiently high temperatures. Nevertheless, the reduced capital investment in production line equipment should prove attractive, and will allow companies lacking capital and infrastructure to make use of technology that would otherwise be beyond their reach.

 

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