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Master Bond Releases New Electrically Conductive Adhesive for Aerospace, Electronics and Specialty OEMs

Posted By ASC, Tuesday, September 27, 2016

Master Bond has released a new, electrically conductive adhesive, Master Bond EP21TDCN-LO. The two component product contains a nickel filler, and can be used for shielding, grounding and dissipation of static electricity. The system has been toughened to tolerate mechanical vibration, shock and rigorous thermal cycling according to the company. It has passed NASA’s ASTM E595 tests, demonstrating low outgassing, has a thermal conductivity of 11 BTU in/ft² hr°F, and a low volume resistivity of 5-10 ohm-cm. 


The high-strength, dimensionally stable epoxy is capable of bonding a wide variety of dissimilar substrates commonly used in the Aerospace, Electronics and OEM industries, including plastics, ceramics, composites and metals. Tensile lap shear was measured at 1,400-1,600 psi, its tensile strength is 3,000-4,000 psi, and its T-peel strength is 15-20 pli. In addition, the adhesive withstands exposure to various chemicals including fuels, oils, organic solvents and water.


Shelf life in sealed containers at room temperature is 6 months. After mixing, the adhesive is a smooth paste, contributing to easy handling and application. Although curing can take place at room temperature, higher temperature curing is more rapid. Master Bond recommends overnight curing at room temperature, with a final 2-3 hours curing at 150-200°F. Once cured, it will retain its properties at temperatures ranging from -100°F to +275°F.


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