Henkel has recently released a thermally conductive version of its Technomelt adhesive. Hot melt adhesives that can be melted, molded and cooled rapidly have already been used as an encapsulation technique for protecting circuitry and PCB assemblies. However, heat dissipation has now been added to the practical benefits offered by these adhesives.
Henkel’s new adhesive is specifically formulated for molding, with a viscosity that makes it suitable for low-pressure molding processes. The new Technomelt product has a thermal conductivity of over 0.5W/m-k, making it applicable to the manufacture of power supplies, LED drivers, camera modules, solar inverters and automotive electronics.
Melt temperature is 180C, and tests showed a 40C reduction in component temperature when compared to the ordinary Technomelt material. By adding a layer of this heat transfer material, electronic component performance, longevity and reliability can be enhanced. Henkel is already developing a formulation that will be able to accommodate even higher thermal load requirements.