The need for a low melting point resin that is also highly chemical resistant with electrical and non-stick properties has led AGC Chemical Americas Inc to develop Fluon® ETFE LH-8000, an adhesive fluoropolymer that is able to bond dissimilar substrates including polyamides, polyethylenes and metals in a one-step process.
The resin has a melting point of 108 – 190 and a wide processing temperature range that minimizes the possibility of material decomposition. The resin will enhance molding equipment lifespans and reduce the need for specialized corrosion-resistant equipment for the co-extrusion of a fluoropolymer layer with engineering plastics thanks to a low level of corrosive off-gas during melt processing.
The new product will be used for a wide range of applications, particularly those requiring multilayer structures, without the need for surface treatments or the inclusion of a tie layer. The manufacture of such items as chemical bags, anti-stick conveyer belts, hot water hoses, interlayer insulation films and the tubes needed to convey harsh chemicals in manufacturing and processing industries simpler and more cost-effective.