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ITW Dynatec to Spotlight Dedicated Solutions for the Packaging Industry at Pack Expo 2015

Posted By ASC, Wednesday, September 9, 2015

ITW Dynatec has recently created a dedicated Packaging Group, serving the specific packaging needs of original equipment manufacturers (OEMs) and end user companies. Scott Holzwarth, Global Business Unit Manager - Packaging for ITW Dynatec commented, “We have developed exclusive programs for packaging OEMs that combine best-in-class hot melt solutions with competitive pricing, to help our OEM partners meet both performance and margin requirements.” ITW Dynatec is well aware that they are one of several hot melt adhesive providers in the packaging market. To help meet customer’s needs, and remove concerns about being locked in to using one provider, ITW Dynatec has designed their applicators and components to be compatible with existing packaging lines. In addition, the company has several “proof of process” labs, where interested customers can experience for themselves on-side evaluation of multiple hot melt assemblies in action.

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